WIRE BOND INTEGRATED CIRCUIT PACKAGE FOR HIGH SPEED I/O

WIRE BOND INTEGRATED CIRCUIT PACKAGE FOR HIGH SPEED I/O

An integrated circuit package includes a package substrate, a die attach pad formed on the package substrate for securing a die to the package substrate, a ground bonding ring formed on the package substrate for attaching core and I/O ground bond wires between the die and the package substrate, and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MORA, LEONARD, AMIN, AMAR, OTHIENO, MAURICE, AWUJOOLA, ABIOLA, FISHLEY, CLIFFORD, CHIA, CHOK J
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An integrated circuit package includes a package substrate, a die attach pad formed on the package substrate for securing a die to the package substrate, a ground bonding ring formed on the package substrate for attaching core and I/O ground bond wires between the die and the package substrate, and a first plurality of bond fingers formed immediately adjacent to the ground bonding ring for attaching a first set of I/O signal bond wires between the package substrate and the die.