Wood fibre insulating board

The board (1) has lower layers (3) connected with a cover layer (2) pointing outwardly in an integral condition. The layers include a thickness of about 10 to 30 millimeters. The cover layer includes a bulk density ranging from 170 kilogram per meter cube to 280 kilogram per meter cube. The lower la...

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Bibliographische Detailangaben
Hauptverfasser:	KUPHAL, GUIDO, JOST, CHRISTOPH.-HOLZWRT, CHMIELEWSKI, DIETMAR DR, BERBNER, STEFAN
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BUILDING BUILDING MATERIALS CEILINGS FIXED CONSTRUCTIONS FLOORS GENERAL BUILDING CONSTRUCTIONS INSULATION OR OTHER PROTECTION OF BUILDINGS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS ROOFS STRUCTURAL ELEMENTS TRANSPORTING WALLS, e.g. PARTITIONS
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Beschreibung
Zusammenfassung:	The board (1) has lower layers (3) connected with a cover layer (2) pointing outwardly in an integral condition. The layers include a thickness of about 10 to 30 millimeters. The cover layer includes a bulk density ranging from 170 kilogram per meter cube to 280 kilogram per meter cube. The lower layers include a bulk density ranging from 120 kilogram per meter cube to 200 kilogram per meter cube. The cover layer includes high bulk density than the lower layers. Thermal conductivity of the board ranges between 0.037 and 0.046 Watt per meter square. The layers are manufactured by wet method. Die Erfindung betrifft eine Holzfaserdämmplatte (1) zur Außendämmung von Gebäuden, wobei die Holzfaserdämmplatte einen Hybridaufbau besitzt. Die Holzfaserdämmplatte nach der Erfindung zeichnet sich besonders dadurch aus, dass einzelne Schichten miteinander verbunden werden und die äußere Deckschicht (2) eine höhere Rohdichte besitzt wie die darunter liegenden Unterschichten (3).