Honeycomb structure-forming die and method for manufacturing the same

A honeycomb structure-forming die 1 has a die substrate 22 including a first plate-shaped member 23 having back holes 6 for introducing a raw forming material and a second plate-shaped member 24 having slits 5 for forming the material into a lattice shape. The first plate-shaped member 23 has column...

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Bibliographische Detailangaben
Hauptverfasser:	HOSOKAWA, HIROFUMI, TAKAHASHI, HIRONORI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASTING COMBINED OPERATIONS INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES MACHINE TOOLS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METAL-WORKING NOT OTHERWISE PROVIDED FOR OTHER WORKING OF METAL PERFORMING OPERATIONS POWDER METALLURGY SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG, OR MIXTURESCONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING UNIVERSAL MACHINE TOOLS WORKING CEMENT, CLAY, OR STONE WORKING METALLIC POWDER WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A honeycomb structure-forming die 1 has a die substrate 22 including a first plate-shaped member 23 having back holes 6 for introducing a raw forming material and a second plate-shaped member 24 having slits 5 for forming the material into a lattice shape. The first plate-shaped member 23 has columnar portions 8 where at least a part is zoned by a slit-shaped groove portion 7 corresponding with a shape of the slit 5 on a bonding face side 28 where the first plate-shaped member 23 is bonded with the second plate-shaped member 24. In the columnar portions 8, the ratio (L/T) of the height L of the columnar portions 8 to the minimum width T in an end face on the bonding face side 28 is within 1/3 to 3.5. Thus constituted die realizes high formability, and two plate-shaped members constituting the die substrate are hardly peeled from each other.