ELECTRONIC COMPONENT MODULE AND METHOD FOR THE PRODUCTION THEREOF

ELECTRONIC COMPONENT MODULE AND METHOD FOR THE PRODUCTION THEREOF

An electronic component module comprising: at least one multilayer ceramic circuit carrier (2, 3); at least one cooling device comprising at least one heat sink; a composite layer (5, 6) arranged at least in regions between the ceramic circuit carrier (2, 3) and the cooling device (4), said composit...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MATZ, RICHARD, WALTER, STEFFEN, MAENNER, RUTH
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic component module comprising: at least one multilayer ceramic circuit carrier (2, 3); at least one cooling device comprising at least one heat sink; a composite layer (5, 6) arranged at least in regions between the ceramic circuit carrier (2, 3) and the cooling device (4), said composite layer being formed for reactive connection to the ceramic circuit carrier (2, 3) during a primary process and for connection to the cooling device (4).