METHOD FOR COMPRESSION MOLDING ELECTRIC COMPONENT AND COMPRESSION MOLDING APPARATUS FOR USE IN THE METHOD

First, a horizontal nozzle (23) is inserted between an upper mold section (6) and a lower mold section (7) in a horizontally extending state. Then, liquid resin (4) is horizontally discharged from a discharge port (29) of the horizontal nozzle (23). Thus, the liquid resin (4) is supplied into a cavi...

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Bibliographische Detailangaben
Hauptverfasser:	YAMADA, TETSUYA, GOTOH, TOMOYUKI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	First, a horizontal nozzle (23) is inserted between an upper mold section (6) and a lower mold section (7) in a horizontally extending state. Then, liquid resin (4) is horizontally discharged from a discharge port (29) of the horizontal nozzle (23). Thus, the liquid resin (4) is supplied into a cavity (10). Thereafter the upper mold section (6) and the lower mold section (7) are closed. Consequently, an electronic component (2) mounted on a substrate (1) is dipped in the liquid resin (4) stored in the cavity (10). Therefore, the electronic component (2) is resin-sealed on the substrate (1) by compression molding.