Method for printing a pattern on a substrate

The invention provides a method for printing a pattern of ink on a substrate, such as corrugated paperboard, with a relief printing form made from a photosensitive element. The method includes forming an in-situ mask for the photosensitive element, exposing the element to actinic radiation through the in-situ mask in an environment having an inert gas and a concentration of oxygen between 190,000 and 100 ppm, and treating the exposed element to form the relief printing form having a pattern of printing areas. Printing is accomplished by securing the relief printing form to a print press, applying the ink to the printing areas on the printing form, and contacting the ink from the printing areas to the substrate to transfer the pattern of ink onto the substrate.