METALLIZED POLYMERIC FILMS
Disclosed herein is an improved, metallized polymer film and method for preparing the same. Such films comprise a) at least one treated polymeric skin layer comprising butylene, and b) a metal layer deposited onto at least one surface of this polymeric skin layer. The polymeric skin layer can compri...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | Disclosed herein is an improved, metallized polymer film and method for preparing the same. Such films comprise a) at least one treated polymeric skin layer comprising butylene, and b) a metal layer deposited onto at least one surface of this polymeric skin layer. The polymeric skin layer can comprise a propylene-butylene copolymer or an ethylene-propylene-butylene terpolymer, with this copolymer or terpolymer containing from about 4 wt % to about 12 wt % of butylene. The polymeric skin layer is preferably preconditioned by subjecting an outermost surface thereof to plasma treatment which facilitates the deposition thereon of a strongly adhering metal layer which is preferably aluminum. The resulting multi-layer films exhibit metal adhesion bond strength of at least about 100 grams/25 mm. These films will preferably also exhibit a Water Vapor Transmission Rate of from about 0.05 to about 0.2 g/m2/24 hour, and an Oxygen Transmission Rate of from about 5.0 to about 20 cm3/m2/24 hour. |
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