Pressure contact in an assembly comprising a power semiconductor module
The arrangement has a power semiconductor module (10) with load and auxiliary connections passing through openings at a cover surface of a plastic housing (9) to connect strip conductors with an electrical contact of an external printed circuit board (5). A thermoplastic insulator body (8) surrounds...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | The arrangement has a power semiconductor module (10) with load and auxiliary connections passing through openings at a cover surface of a plastic housing (9) to connect strip conductors with an electrical contact of an external printed circuit board (5). A thermoplastic insulator body (8) surrounds the module positioned between the board and a cooling body having a fan in an entire volume of the body (8). A low pressure in relation to an ambient pressure exists inside the body (8) forming flush-mounted force fit connections with end surfaces (84, 86) turned to the board and the cooling body. |
|---|