INTEGRATED MEMS PACKAGING

A micro-electromechanical systems (MEMS) package that includes a substrate onto which is disposed or otherwise formed an active MEMS device, a first barrier wall for preventing sealant from contaminating the MEMS device, a second barrier wall for preventing sealant from contaminating unintended area...

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Bibliographische Detailangaben
Hauptverfasser:	LU, JUN, MÉNARD, STÉPHANE
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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Beschreibung
Zusammenfassung:	A micro-electromechanical systems (MEMS) package that includes a substrate onto which is disposed or otherwise formed an active MEMS device, a first barrier wall for preventing sealant from contaminating the MEMS device, a second barrier wall for preventing sealant from contaminating unintended areas of the substrate, and a cap for hermetically sealing the MEMS package with a particular gas or mixtures thereof which enhance the MEMS performance.