METHOD FOR MANUFACTURING ELECTROFORMED MOLD, ELECTROFORMED MOLD, AND METHOD FOR MANUFACTURING ELECTROFORMED PARTS

In a method of manufacturing an electroforming mold, a first photoresist layer is formed on an upper surface of a bottom conductive film 2 of a substrate 1, and the first photoresist layer 3 is divided into a soluble portion 3b and an insoluble portion 3a. Next, a conductive material is thermally deposited on an upper surface of the first photoresist layer within a temperature range in which light with a wavelength within a range not causing photoreaction in the first photoresist layer is emitted, to thereby form an intermediate conductive film 5. Next, the intermediate conductive film is patterned. Thereafter, a second photoresist layer 6 is formed on an exposed upper surface of the first photoresist layer after the intermediate conductive film is removed, and on an upper surface of the intermediate conductive film remaining after patterning. The second photoresist layer is divided into a soluble portion 6b and an insoluble portion 6a. Next, the first photoresist layer and the second photoresist layer are developed, and the soluble portions 3b and 6b are removed. Thus, an electroforming mold 101 having a conductive film at the bottom of each stage is obtained.