RESINOUS COMPOSITIONS, ARTICLES MADE THEREFROM AND PROCESS

Disclosed is a resinous composition having reduced susceptibility to scratch formation during abrasion of its surface, wherein the composition comprises: (i) 10-40 wt.%, based on the weight of resinous components in the composition, of at least one rubber modified thermoplastic resin comprising a di...

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Bibliographische Detailangaben
Hauptverfasser: HUIJS, FRANK, ARNOULD, DOMINIQUE DANIEL, AKKERMANS, ROLAND
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:Disclosed is a resinous composition having reduced susceptibility to scratch formation during abrasion of its surface, wherein the composition comprises: (i) 10-40 wt.%, based on the weight of resinous components in the composition, of at least one rubber modified thermoplastic resin comprising a discontinuous elastomeric phase dispersed in a first rigid thermoplastic phase, wherein at least a portion of the first rigid thermoplastic phase is grafted to the elastomeric phase, and wherein the elastomeric phase comprises structural units derived from a monomer selected from the group consisting of butadiene and butadiene-styrene mixture; and wherein the first rigid thermoplastic phase comprises structural units derived from at least one vinyl aromatic monomer, at least one monoethylenically unsaturated nitrile monomer, and optionally at least one (C 1 -C 12 )alkyl- and aryl-(meth)acrylate monomer; and (ii) 90-60 wt.%, based on the weight of resinous components in the composition, of a second rigid thermoplastic polymer comprising a polymer with structural units derived from monomers selected from the group consisting of styrene/acrylonitrile/methyl methacrylate, alpha-methyl styrene/acrylonitrile/ methyl methacrylate, alphamethylstyrene/styrene/acrylonitrile/methyl methacrylate, and mixtures thereof, wherein said structural units are derived from 15-68 wt. % methyl methacrylate, based on the weight of monomers employed. Also disclosed is a process for forming the composition. Articles comprising a composition of the invention and/or made by the process described are also disclosed.