CREAM SOLDER AND METHOD OF SOLDERING ELECTRONIC PART

The present invention aims at providing a high-temperature lead-free solder material which can form a solder joint of improved heat resistance and reliability, and is suitable for application to dual-temperature solder connection, and a method of soldering an electronic part. According to the invent...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ASAGI, TAKESHI, GOTO, TOMOAKI, YAMASHITA, MITSUO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The present invention aims at providing a high-temperature lead-free solder material which can form a solder joint of improved heat resistance and reliability, and is suitable for application to dual-temperature solder connection, and a method of soldering an electronic part. According to the invention a solder cream is obtained by kneading an Sn-Ag-Cu alloy with a flux, wherein the Sn-Ag-Cu alloy comprises a mixture of a first powder alloy containing 10 to 30% by weight of Ag and 2 to 20% by weight of Cu with a balance consisting of Sn and unavoidable impurities, and a second powder alloy containing smaller compositions (% by weight) of Ag and Cu than the first powder alloy, and having a melting point lower than that of the first powder alloy, the mixture containing a total of not more than 35% by weight of Ag and Cu.