Method for bonding a tantalum structure to a cobalt-alloy substrate

A method for bonding a porous tantalum structure (10) to a substrate (12) is provided. The method comprises providing a substrate (12) comprising cobalt or a cobalt-chromium alloy; an interlayer (16) consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titaniu...

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Bibliographische Detailangaben
Hauptverfasser:	PEEK, LAWRENCE F, GORHE, DEVENDRA, HIPPENSTEEL, GREGORY, ALLEN, STEVE M, ANDERSON, JEFFREY P
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BANDAGES, DRESSINGS OR ABSORBENT PADS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF,TUBULAR STRUCTURES OF THE BODY, E.G. STENTS FILTERS IMPLANTABLE INTO BLOOD VESSELS FIRST-AID KITS FOMENTATION GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HUMAN NECESSITIES HYGIENE MACHINE TOOLS MEDICAL OR VETERINARY SCIENCE METAL-WORKING NOT OTHERWISE PROVIDED FOR ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES PERFORMING OPERATIONS PROSTHESES SOLDERING OR UNSOLDERING TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING TREATMENT OR PROTECTION OF EYES OR EARS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method for bonding a porous tantalum structure (10) to a substrate (12) is provided. The method comprises providing a substrate (12) comprising cobalt or a cobalt-chromium alloy; an interlayer (16) consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof; and a porous tantalum structure (10). Heat and pressure are applied to the substrate (12), the interlayer (16), and the porous tantalum structure (10) to achieve solid-state diffusion between the substrate (12) and the interlayer (16) and between the interlayer (16) and the porous tantalum structure (10).