MULTILAYER SEALANT FILM, METHOD OF MAKING IT, AND HEAT SEALABLE COATING COMPOSITION

A multilayer film suitable for sealing containers such as used for food packaging, and methods of making the film, are described. The film is particularly suitable for sealing containers made from polylactic acid (PLA). The multilayer film includes: a) a substrate that includes a polymeric base laye...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	DENG, Fenghua
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A multilayer film suitable for sealing containers such as used for food packaging, and methods of making the film, are described. The film is particularly suitable for sealing containers made from polylactic acid (PLA). The multilayer film includes: a) a substrate that includes a polymeric base layer; and b) on the substrate, a heatseal layer containing a PLA homopolymer or copolymer. The heatseal layer further includes dispersed therein an adhesion promoter, or alternatively the substrate further includes the adhesion promoter in a layer on a surface of the polymeric base layer between and adjacent the base layer and the heatseal layer. An antifog agent may also be included in the heatseal layer or on the surface of the heatseal layer opposite the substrate.