HOT-MELT ADHESIVE FOR FIXING IC MODULE, AND LAMINATED TAPE AND IC CARD USING THE ADHESIVE

An objective of the present invention is to provide a hot-melt adhesive for fixing an IC module, which has sufficient transparency and excellent solvent resistance, and to provide a laminated tape and an IC card formed using the adhesive. The hot-melt adhesive for fixing an IC module comprises a sat...

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Bibliographische Detailangaben
1. Verfasser:	IMAHORI, Makoto
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CALCULATING CHEMISTRY COMPUTING COUNTING DYES HANDLING RECORD CARRIERS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PHYSICS POLISHES PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	An objective of the present invention is to provide a hot-melt adhesive for fixing an IC module, which has sufficient transparency and excellent solvent resistance, and to provide a laminated tape and an IC card formed using the adhesive. The hot-melt adhesive for fixing an IC module comprises a saturated polyester resin having a heat of fusion of 8-25 mJ/mg and a transmittance of 5% or higher when a film of the adhesive having a thickness of 30 µm is subjected to measurement by a visible light at a wavelength of 600 nm. The laminated tape (T) of the present invention is provided with an IC module tape (121) having an IC module substrate tape (121a), an IC chip (12b) arranged on one surface of the tape and a sealing part (12c), and an adhesive tape (131), which is formed using the present hot-melt adhesive for fixing an IC module and is bonded to one surface of the IC module substrate tape (121a) and the sealing part (12c). Furthermore, the IC card of the present invention is provided with a card body, an IC module and an adhesive layer bonding the card body and the IC module.