Interpenetrating network for chemical mechanical polishing

Interpenetrating network for chemical mechanical polishing

Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer (202,302,402) comprising an interpenetrating network including a continuous non-fugitive phase (207,307,407) and a substantially co-continuous fugitive phase (205,305,405). Also pro...

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Bibliographische Detailangaben
1. Verfasser: MULDOWNEY, GREGORY P
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Beschreibung
Zusammenfassung:Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer (202,302,402) comprising an interpenetrating network including a continuous non-fugitive phase (207,307,407) and a substantially co-continuous fugitive phase (205,305,405). Also provided are methods of making the chemical mechanical polishing pads and for using them to polish substrates.