Chemical mechanical polishing pad with controlled wetting

Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising a polishing texture that exhibits a dimensionless roughness, R, is between 0.01 and 0.75. Also provided are methods of making the chemical mechanical polishing pads and f...

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Hauptverfasser: PALAPARTHI, RAVICHANDRA V, MULDOWNEY, GREGORY P, JIANG, BO
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Sprache:eng ; fre ; ger
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creator PALAPARTHI, RAVICHANDRA V
MULDOWNEY, GREGORY P
JIANG, BO
description Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising a polishing texture that exhibits a dimensionless roughness, R, is between 0.01 and 0.75. Also provided are methods of making the chemical mechanical polishing pads and for using them to polish substrates.
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language eng ; fre ; ger
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subjects DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
title Chemical mechanical polishing pad with controlled wetting
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