Chemical mechanical polishing pad with controlled wetting

Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising a polishing texture that exhibits a dimensionless roughness, R, is between 0.01 and 0.75. Also provided are methods of making the chemical mechanical polishing pads and f...

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Bibliographische Detailangaben
Hauptverfasser: PALAPARTHI, RAVICHANDRA V, MULDOWNEY, GREGORY P, JIANG, BO
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising a polishing texture that exhibits a dimensionless roughness, R, is between 0.01 and 0.75. Also provided are methods of making the chemical mechanical polishing pads and for using them to polish substrates.