METHOD TO PREVENT METAL CONTAMINATION BY A SUBSTRATE HOLDER

The invention relates to a method to increase the wettability of a substrate by providing said substrate at least partially with a conductive, metal free, hydrophilic carbon based coating. The carbon based coating is doped with nitrogen and has an electrical resistivity lower than 10 8 ohm-cm. The i...

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Bibliographische Detailangaben
Hauptverfasser:	ACKERMAN, CYNDI, L, KIRK, MATTHEW P, DEKEMPENEER, ERIK, VENKATRAMAN, CHANDRA, GROENEN, ROLAND
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The invention relates to a method to increase the wettability of a substrate by providing said substrate at least partially with a conductive, metal free, hydrophilic carbon based coating. The carbon based coating is doped with nitrogen and has an electrical resistivity lower than 10 8 ohm-cm. The invention further relates to a substrate coated at least partially with a conductive metal free, hydrophilic carbon based coating.