SEMICONDUCTOR DEVICE, ELECTRONIC PARTS MODULE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE

Provided is a semiconductor device including a semiconductor element, the semiconductor device having satisfactory heat dissipation characteristics and being capable of being easily manufactured. A semiconductor element (12) is provided with a heat dissipating path (18) defined by a non-through hole...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	NAKAGOSHI, HIDEO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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