SEMICONDUCTOR DEVICE, ELECTRONIC PARTS MODULE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE

Provided is a semiconductor device including a semiconductor element, the semiconductor device having satisfactory heat dissipation characteristics and being capable of being easily manufactured. A semiconductor element (12) is provided with a heat dissipating path (18) defined by a non-through hole (16) opened to a first principal surface (13) and formed by filling the non-through hole (16) with a conductive material (17). The semiconductor element (12) is bonded to a heat sink (14) with the conductive material (17) disposed therebetween. Solder can be used as one preferable example of the conductive material (17). By introducing molten solder being molten into the non-through hole (16) while having solder disposed between the semiconductor element (12) and the heat sink (14), the heat dissipating path (18) is formed and the state in which the heat sink (14) is bonded to the semiconductor element (12) is obtained.