Device and method for populating substrates with components

The device (100) has a component with a x-y-positioning system (104). The x-y-z-positioning system has a x-carrier (108), and the component holding device (102) is movably arranged in the x-carrier. An optical inspection system is provided for inspecting a substrate (124) with a camera (120) that is...

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Bibliographische Detailangaben
Hauptverfasser:	BRANDIS, TILO, MUELLER, WERNER, LIEGEL, WERNER, NEGELE, ROBERT
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The device (100) has a component with a x-y-positioning system (104). The x-y-z-positioning system has a x-carrier (108), and the component holding device (102) is movably arranged in the x-carrier. An optical inspection system is provided for inspecting a substrate (124) with a camera (120) that is movably arranged in the x-carrier. The component holding device and the camera are arranged at various longitudinal side surfaces of an elongated x-carrier. An independent claim is also included for a method for assembling of substrates.