POLYPHENYLENE SULFIDE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND MOLDED ARTICLE

A polyphenylene sulfide resin composition which comprises: 100 parts by weight of a resin composition comprising (a) 99-60 wt.% polyphenylene sulfide resin and (b) 1-40 wt.% at least one noncrystalline resin selected among polyetherimide resins and polyether sulfone resins, the sum of (a) and (b) be...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA, Naoya, ISHIO, Atsushi, SAITOH, Kei
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MAKING GRANULES OR PREFORMS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A polyphenylene sulfide resin composition which comprises: 100 parts by weight of a resin composition comprising (a) 99-60 wt.% polyphenylene sulfide resin and (b) 1-40 wt.% at least one noncrystalline resin selected among polyetherimide resins and polyether sulfone resins, the sum of (a) and (b) being 100 wt.%; and 0.1-10 parts by weight of (C) a compound incorporated therein which has one or more groups selected among epoxy, amino, and isocyanate groups. The polyphenylene sulfide resin composition is characterized by having a morphology in which the noncrystalline resin (b) forms an island phase and the noncrystalline resin (b) has a number-average dispersed-particle diameter of 1,000 nm or smaller. This composition has highly excellent toughness, less generates a gas upon thermal melting, and has excellent processability.