EMI SHIELDING AND THERMAL MANAGEMENT ASSEMBLIES INCLUDING FRAMES AND COVERS WITH MULTI-POSITION LATCHING

EMI SHIELDING AND THERMAL MANAGEMENT ASSEMBLIES INCLUDING FRAMES AND COVERS WITH MULTI-POSITION LATCHING

According to various aspects of the present disclosure, exemplary embodiments are of assemblies capable of providing board level EMI shielding and heat dissipation of one or more electrical components. Other aspects relate to components of such assemblies. Further aspects relate to methods of using...

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Bibliographische Detailangaben
Hauptverfasser: ZUEHLSDORF, ALLAN, RICHARD, ENGLISH, GERALD, ROBERT
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:According to various aspects of the present disclosure, exemplary embodiments are of assemblies capable of providing board level EMI shielding and heat dissipation of one or more electrical components. Other aspects relate to components of such assemblies. Further aspects relate to methods of using EMI shielding and thermal management assemblies. Additional aspects relate to methods of making EMI shielding and thermal management assemblies, and methods of making the components thereof.