METAL FILM ENCAPSULATION

METAL FILM ENCAPSULATION

The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.

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Hauptverfasser: NEUDECKER, Bernd J, BRANTNER, Paul C, SNYDER, Shawn W
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRICITY
PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY
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creator NEUDECKER, Bernd J
BRANTNER, Paul C
SNYDER, Shawn W
description The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.
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language eng ; fre ; ger
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subjects BASIC ELECTRIC ELEMENTS
ELECTRICITY
PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY
title METAL FILM ENCAPSULATION
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