METAL FILM ENCAPSULATION

The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.

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Bibliographische Detailangaben
Hauptverfasser:	NEUDECKER, Bernd J, BRANTNER, Paul C, SNYDER, Shawn W
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRICITY PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY
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Beschreibung
Zusammenfassung:	The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.