CURABLE COMPOSITION

The present invention ha's its object to provide a curable composition which shows practical level of curability, without using any toxic organotin type curing catalyst. Further, The present invention has its object to provide a curable composition which has good tensile characteristics and goo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YANO, AYAKO, OKAMOTO, TOSHIHIKO, NORO, NORIKO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention ha's its object to provide a curable composition which shows practical level of curability, without using any toxic organotin type curing catalyst. Further, The present invention has its object to provide a curable composition which has good tensile characteristics and good weather resistance while retaining practical levels of surface curability and depth curability; the above objects can be achieved by a curable composition which comprises: (A) 1 to 80 parts by weight of an organic polymer containing a reactive silyl group such as an alkyldialkoxysilyl group in a molecule; (B) 99 to 20 parts by weight of an organic polymer containing a reactive silyl group such as an alkyldialkoxysilyl group in a molecule, and having a main chain skeleton comprising a repeating unit different from that of the component (A); and (C) 0.1 to 30 parts by weight of a guanidine compound per 100 parts by weight of the sum of the component (A) and the component (B).