METHOD AND ARRANGEMENT FOR FORMING ELECTRONIC DEVICE

An insert (2) is arranged in an injection mould (1) and plastic is cast onto the insert (2). The insert (2) includes at least one electronic component and connector (4) for testing the component. The injection mould (1) is provided with a counter connector (5) which is arranged to connect to the con...

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Bibliographische Detailangaben
Hauptverfasser:	PELTOLA, TERO, MUUKKONEN, ESA
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	An insert (2) is arranged in an injection mould (1) and plastic is cast onto the insert (2). The insert (2) includes at least one electronic component and connector (4) for testing the component. The injection mould (1) is provided with a counter connector (5) which is arranged to connect to the connector (4). The condition of the insert (2) is tested by a testing device connected to the counter connector (5) during the injection moulding process.