Electronic component mounting apparatus

The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices (3) need not be provided on both sides of a carrying device (2) respectively for reasons of types of electronic components or a setting space and increases an oper...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	IIZUKA, MASAMI, OYAMA, KAZUYOSHI, IZUHARA, KOICHI, ONOGUCHI, YOSHIHIRO, KOBAYASHI, HIROOMI, KASHITANI, HISAYOSHI, MITSUMOCHI, YUTAKA
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices (3) need not be provided on both sides of a carrying device (2) respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam (4A, B) to enhance production efficiency. An electronic component mounting apparatus has a carrying device (2) carrying a printed board (P), a component feeding device (3) supplying electronic components, a pair of beams (4A, B) movable in one direction by drive sources, and mounting heads (6) each having suction nozzles (5) and movable along the beams by drive sources. The component feeding device is provided on only one side of the carrying device (2), and the suction nozzles (5) provided on each of the mounting heads (6) pick up electronic components from the component feeding device (3) and mount the electronic components on a printed board (P) by moving the mounting heads (6) provided on both the beams (4A, B) between the printed board (P) on the carrying device (2) and the component feeding device (3) by driving the drive sources respectively.