Method for manufacturing an electromechanical switch
The method involves assembling a printed circuit board (2) with a component (5). Resistance measurement is accomplished between contact points (12) of the printed circuit board, after the assembly of the printed circuit board with the component, and before the continuation of the assembly of the pri...
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Hauptverfasser: | , , , , , |
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | The method involves assembling a printed circuit board (2) with a component (5). Resistance measurement is accomplished between contact points (12) of the printed circuit board, after the assembly of the printed circuit board with the component, and before the continuation of the assembly of the printed circuit board with the components and/or further processing of the printed circuit board. The contact points are provided for contacting the components. Independent claims are also included for the following: (1) a device for assembling a printed circuit board with the components (2) an electromechanical switch with contacts for contacting the printed circuit board (3) a method for producing the component e.g. electromechanical switch (4) an arrangement for producing the component e.g. electromechanical switch.
Die Erfindung betrifft ein Verfahren zur Ermittlung eines Vorhandenseins eines Bauelements(5), eine Vorrichtung (1) zum Bestücken einer Platine (2) mit Bauelementen (5, 16) sowie einen elektromechanischen Schalter (6) und dessen Herstellungsverfahrens. |
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