SURFACE ACOUSTIC WAVE PACKAGES AND METHODS OF FORMING SAME

A sensor package generally includes a substrate and one or more sensing elements, located on a surface of the substrate. A lid, such as for example a glass cap, is coupled to the substrate such that the lid and substrate define a sealed cavity accommodating the sensing element(s). The lid has at lea...

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Bibliographische Detailangaben
Hauptverfasser: BOHNERT, LARRY, J, HASKEN, RANDALL, J, MAGEE, STEVEN, J
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:A sensor package generally includes a substrate and one or more sensing elements, located on a surface of the substrate. A lid, such as for example a glass cap, is coupled to the substrate such that the lid and substrate define a sealed cavity accommodating the sensing element(s). The lid has at least one conductive via or well electrically coupled to the sensing element(s) inside the cavity and arranged so as to provide an electrical connection to the exterior of the lid for connecting with external circuitry. The substrate can be a piezoelectric substrate and each sensing element can consist of an interdigital transducer such that the substrate and interdigital transducer(s) define a surface acoustic wave sensor. A surface acoustic wave sensor system for sensing torque includes the sensor package and leads wire bonded to the conductive vias for attaching the sensor package to an antenna.