CONDUCTIVE PASTE, MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC SUBSTRATE

A conductive paste comprising 88-94% by mass of Ag powder having an average particle size of 3 µm or less and 0.1-3% by mass of Pd powder, the total amount of the Ag powder and the Pd powder being 88.1-95% by mass. A multilayer ceramic substrate obtained by laminating and sintering pluralities of ce...

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Bibliographische Detailangaben
Hauptverfasser:	IKEDA, HATSUO, ICHIKAWA, KOJI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A conductive paste comprising 88-94% by mass of Ag powder having an average particle size of 3 µm or less and 0.1-3% by mass of Pd powder, the total amount of the Ag powder and the Pd powder being 88.1-95% by mass. A multilayer ceramic substrate obtained by laminating and sintering pluralities of ceramic green sheets, and having conductor patterns and via-conductors inside, the via-conductors being formed in via-holes having diameters of 150 µm or less after sintering, containing Ag crystal particles having a particle size of 25 µm or more, and having a porosity of 10% or less.