Method and Apparatus for Testing Solderability of Electrical Components

The described embodiments relate generally to methods and system for use in determining solderability of an electrical component. One particular aspect relates to a system for measuring solderability of an electrical component, comprising: a vacuum chamber; a load sensor having a contact portion, the contact portion being disposed within the vacuum chamber; a first receptacle for containing solder; a platform or support disposed within the vacuum chamber in relation to the contact portion and having a component mounting surface for mounting the electrical component; and a control and communications module for causing relative movement between the platform or support and the load sensor so that a contact surface of the electrical component is brought into close proximity with the contact portion. When the contact portion has solder thereon and the solder is brought into contact with the contact surface, the load sensor measures force arising from wetting of the solder to the contact surface; wherein the control and communications module is configured to monitor sensed conditions within the system. The force generated under contact changes over time, depending on the degree of solderability of the electrical component. Thus, measurement of the wetting forces over time provides an indication of the solderability of the electrical component.