Emitting surface of light emitting diode packages
A LED package comprises: - a LED chip (1) mounted on a housing, and - an essentially transparent layer (2) on top of the LED chip (1), the transparent layer (2) having an essentially flat light exit surface (4). The light exit surface (4) is provided with a plurality of microstructures (5) distribut...
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| creator | TASCH, STEFAN DERKITS, CHRISTIAN CHELLY, NADER |
| description | A LED package comprises:
- a LED chip (1) mounted on a housing, and
- an essentially transparent layer (2) on top of the LED chip (1),
the transparent layer (2) having an essentially flat light exit surface (4). The light exit surface (4) is provided with a plurality of microstructures (5) distributed over the plane of the light exit surface (4). The microstructures (5) are geometrically designed for enhancing the light exit by the microstructures (5) offering differing angles for light rays from the interior of the transparent layer (2). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP1962350A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP1962350A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP1962350A13</originalsourceid><addsrcrecordid>eNrjZDB0zc0sKcnMS1coLi1KS0xOVchPU8jJTM8oUUiFyaRk5qekKhQkJmcnpqcW8zCwpiXmFKfyQmluBgU31xBnD93Ugvz41GKgstS81JJ41wBDSzMjY1MDR0NjIpQAADjiKzA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Emitting surface of light emitting diode packages</title><source>esp@cenet</source><creator>TASCH, STEFAN ; DERKITS, CHRISTIAN ; CHELLY, NADER</creator><creatorcontrib>TASCH, STEFAN ; DERKITS, CHRISTIAN ; CHELLY, NADER</creatorcontrib><description>A LED package comprises:
- a LED chip (1) mounted on a housing, and
- an essentially transparent layer (2) on top of the LED chip (1),
the transparent layer (2) having an essentially flat light exit surface (4). The light exit surface (4) is provided with a plurality of microstructures (5) distributed over the plane of the light exit surface (4). The microstructures (5) are geometrically designed for enhancing the light exit by the microstructures (5) offering differing angles for light rays from the interior of the transparent layer (2).</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080827&DB=EPODOC&CC=EP&NR=1962350A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080827&DB=EPODOC&CC=EP&NR=1962350A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TASCH, STEFAN</creatorcontrib><creatorcontrib>DERKITS, CHRISTIAN</creatorcontrib><creatorcontrib>CHELLY, NADER</creatorcontrib><title>Emitting surface of light emitting diode packages</title><description>A LED package comprises:
- a LED chip (1) mounted on a housing, and
- an essentially transparent layer (2) on top of the LED chip (1),
the transparent layer (2) having an essentially flat light exit surface (4). The light exit surface (4) is provided with a plurality of microstructures (5) distributed over the plane of the light exit surface (4). The microstructures (5) are geometrically designed for enhancing the light exit by the microstructures (5) offering differing angles for light rays from the interior of the transparent layer (2).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB0zc0sKcnMS1coLi1KS0xOVchPU8jJTM8oUUiFyaRk5qekKhQkJmcnpqcW8zCwpiXmFKfyQmluBgU31xBnD93Ugvz41GKgstS81JJ41wBDSzMjY1MDR0NjIpQAADjiKzA</recordid><startdate>20080827</startdate><enddate>20080827</enddate><creator>TASCH, STEFAN</creator><creator>DERKITS, CHRISTIAN</creator><creator>CHELLY, NADER</creator><scope>EVB</scope></search><sort><creationdate>20080827</creationdate><title>Emitting surface of light emitting diode packages</title><author>TASCH, STEFAN ; DERKITS, CHRISTIAN ; CHELLY, NADER</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP1962350A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2008</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TASCH, STEFAN</creatorcontrib><creatorcontrib>DERKITS, CHRISTIAN</creatorcontrib><creatorcontrib>CHELLY, NADER</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TASCH, STEFAN</au><au>DERKITS, CHRISTIAN</au><au>CHELLY, NADER</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Emitting surface of light emitting diode packages</title><date>2008-08-27</date><risdate>2008</risdate><abstract>A LED package comprises:
- a LED chip (1) mounted on a housing, and
- an essentially transparent layer (2) on top of the LED chip (1),
the transparent layer (2) having an essentially flat light exit surface (4). The light exit surface (4) is provided with a plurality of microstructures (5) distributed over the plane of the light exit surface (4). The microstructures (5) are geometrically designed for enhancing the light exit by the microstructures (5) offering differing angles for light rays from the interior of the transparent layer (2).</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Emitting surface of light emitting diode packages |
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