Emitting surface of light emitting diode packages

Emitting surface of light emitting diode packages

A LED package comprises: - a LED chip (1) mounted on a housing, and - an essentially transparent layer (2) on top of the LED chip (1), the transparent layer (2) having an essentially flat light exit surface (4). The light exit surface (4) is provided with a plurality of microstructures (5) distribut...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TASCH, STEFAN, DERKITS, CHRISTIAN, CHELLY, NADER
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A LED package comprises: - a LED chip (1) mounted on a housing, and - an essentially transparent layer (2) on top of the LED chip (1), the transparent layer (2) having an essentially flat light exit surface (4). The light exit surface (4) is provided with a plurality of microstructures (5) distributed over the plane of the light exit surface (4). The microstructures (5) are geometrically designed for enhancing the light exit by the microstructures (5) offering differing angles for light rays from the interior of the transparent layer (2).