Printed circuit board

A printed circuit board (100) includes a base insulating layer (1), first to third signal lines (3a,3b,3c), a first cover insulating layer (4) and a conductive layer (6). Wide parts (31,32,33) are formed in the first to third signal lines (3a,3b,3c). The first cover insulating layer (4) is provided...

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1. Verfasser: MITSURU, HONJO
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A printed circuit board (100) includes a base insulating layer (1), first to third signal lines (3a,3b,3c), a first cover insulating layer (4) and a conductive layer (6). Wide parts (31,32,33) are formed in the first to third signal lines (3a,3b,3c). The first cover insulating layer (4) is provided on the base insulating layer (1) so as to cover the wide parts (31,32,33). The conductive layer (6) is provided on the first cover insulating layer (4) so as to cover a portion above the wide parts (31,32,33). A capacitive element is formed of the wide part (31,32,33), the cover insulating layer (4) and the conductive layer (6). Generation of high-frequency noise can be prevented.