HEAT-RESISTANT RESIN COMPOSITION

Disclosed is a resin composition comprising an aromatic polyamide having a terminal amino group concentration of 5 to 45 µ moles/g inclusive, polyphenylene ether, a compatibilizing agent for the polyamide and the polyphenylene ether, and a crystal nucleating agent. The composition is extremely usefu...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	NODA, KAZUYA, MIYOSHI, TAKAAKI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Disclosed is a resin composition comprising an aromatic polyamide having a terminal amino group concentration of 5 to 45 µ moles/g inclusive, polyphenylene ether, a compatibilizing agent for the polyamide and the polyphenylene ether, and a crystal nucleating agent. The composition is extremely useful in an automotive body panel (e.g., an automotive fender), an SMT-compliant component or the like.