CHIP ASSEMBLY AND METHOD OF MANUFACTURING THEREOF

An assembly of a first chip (100) and a second chip (200), which first chip (100) is flexible and is provided with a first and a second resin layer (12, 52) on opposite sides (1, 2) of the chip (100), which allows to keep the first chip under compressive conditions, on which first and second side (1...

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Bibliographische Detailangaben
Hauptverfasser:	TAK, COENRAAD, C, VAN VEEN, NICOLAAS, J., A, DEKKER, RONALD
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	An assembly of a first chip (100) and a second chip (200), which first chip (100) is flexible and is provided with a first and a second resin layer (12, 52) on opposite sides (1, 2) of the chip (100), which allows to keep the first chip under compressive conditions, on which first and second side (1,2) respectively first side contact pads (33) and second side contact pads (31) are present, which first side contact pads (33) are coupled to corresponding contact pads (211) of the second chip (200), and which second side contact pads (31) are designed for external connection of the assembly.