Method and apparatus for breaking semiconductor substrate, method for breaking solar cell and method for fabrication of solar cell module

A method and apparatus for breaking a semiconductor substrate along a predetermined area over which a split groove is formed. The breaking apparatus includes a table for placing a portion of the semiconductor substrate inside the predetermined area and a breaking blade being operable to move downwar...

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Bibliographische Detailangaben
1. Verfasser: KANNOU, HIROYUKI
Format: Patent
Sprache:eng ; fre ; ger
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