Method and apparatus for breaking semiconductor substrate, method for breaking solar cell and method for fabrication of solar cell module
A method and apparatus for breaking a semiconductor substrate along a predetermined area over which a split groove is formed. The breaking apparatus includes a table for placing a portion of the semiconductor substrate inside the predetermined area and a breaking blade being operable to move downwar...
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | A method and apparatus for breaking a semiconductor substrate along a predetermined area over which a split groove is formed. The breaking apparatus includes a table for placing a portion of the semiconductor substrate inside the predetermined area and a breaking blade being operable to move downward from a position above the semiconductor substrate placed on the table to thereby compress a portion of the semiconductor substrate outside the predetermined area so that the semiconductor substrate is broken along the split groove. The predetermined area of the semiconductor substrate has at least a neighboring pair of sides intersecting at an angle of less than 180 degrees, and the breaking blade has a projection which, when the semiconductor substrate is broken, compresses a portion of the semiconductor substrate outside the one side so that the one side is compressed ahead of the other side. |
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