PACKAGE, METHOD OF MANUFACTURING THE SAME AND USE THEREOF

PACKAGE, METHOD OF MANUFACTURING THE SAME AND USE THEREOF

The flexible package (100) comprises coupling means (20) for electrical coupling to an external component, a chip (30) with contact pads (32) that face the coupling means (20) and are electrically coupled thereto, and an electrically insulating encapsulation (40) encapsulating the chip (30) and bein...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: VAN VEEN, NICOLAAS, J., A, WEEKAMP, JOHANNES, W
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The flexible package (100) comprises coupling means (20) for electrical coupling to an external component, a chip (30) with contact pads (32) that face the coupling means (20) and are electrically coupled thereto, and an electrically insulating encapsulation (40) encapsulating the chip (30) and being attached to the coupling means (20), said encapsulation (40) and said coupling means (20) constituting a substrate for the chip (30). The package (100) further comprises means (50) for handling the package (100). This means (50) is mechanically connected to the coupling means (20) through the encapsulation (40) only. The package (100) is suitable for assembly to a foil, which may be attached to or integrated in an article such as a security paper.