Electronics enclosure and method of fabricating an electronics enclosure

A device (10) for enclosing electronics and providing an electrical connection to the enclosed electronics is provided. The device (10) includes a housing (14) having alignment and barrier features (16,18), and a circuit board (20) having alignment features (28) and plated through-holes (22). The circuit board (20) is coupled to the housing (14) such that the alignment features (28,16) of the circuit board (20) and housing (14) are aligned, and such that the barrier features (18) of the housing (14) are located adjacent the plated through-holes (22). The device further includes an epoxy material (40) that at least partially coats the surfaces of the housing (14) and circuit board (20). The barrier features (18) separate the plated through-holes (22) from the epoxy material (40), such that the epoxy material (40) is not in contact with the interior surface of the plated through-holes (22). A method for enclosing electronics and providing an electrical connection to the enclosed electronics is also provided.