An induction wafer baking system

The present invention relates to an automatic wafer baking apparatus (1) for baking wafers from a liquid or pasty dough, said apparatus (1) comprising at least two baking moulds (2), each having one pair of top (3) and lower (4) baking plates, said apparatus (1) further comprising moving means (5, 6...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: PARSONS, NICHOLAS TYERS
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:The present invention relates to an automatic wafer baking apparatus (1) for baking wafers from a liquid or pasty dough, said apparatus (1) comprising at least two baking moulds (2), each having one pair of top (3) and lower (4) baking plates, said apparatus (1) further comprising moving means (5, 6, 7) for moving at least one plate relative to the other so that each baking mould (2) can move from a closed configuration to an open configuration, heating means for heating the plates (3, 4) to a predetermined baking temperature, means for injecting a predetermined quantity of dough between the baking plates (3, 4) of each mould (2), and means (12, 13) for removing a baked wafer from a baking mould (2), characterized in that each baking mould (2) is stationary in the apparatus (1) and is independent from the other(s).