WARPAGE PREVENTING SUBSTRATES AND METHOD OF MAKING SAME

WARPAGE PREVENTING SUBSTRATES AND METHOD OF MAKING SAME

Consistent with an example embodiment, there is an apparatus comprising a circuit (500) board. The circuit board includes a first surface (501a) and a second surface (501b). The first and second surfaces each have at least a component populated thereon; the circuit board has a first surface thereof...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: VAN DEN BOOMEN, R.W.J
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:Consistent with an example embodiment, there is an apparatus comprising a circuit (500) board. The circuit board includes a first surface (501a) and a second surface (501b). The first and second surfaces each have at least a component populated thereon; the circuit board has a first surface thereof populated before a second surface thereof and is overmolded. The circuit board has conductive material disposed over areas of the second surface defining at least a feature (504) on the second surface. The at least a feature is defined by the conductive material and other than defined by solder resist (508) disposed on the second surface overlapping the conductive material, wherein the at least a feature is a feature for remaining exposed during a process of populating the first surface other than a fiducial.