Silicon on metal for MEMS devices

Silicon on metal for MEMS devices

Micro-electromechanical systems (MEMS) pre-fabrication products and methods for forming MEMS devices using silicon-on-metal (SOM) wafers. An embodiment of a method may include the steps of bonding a patterned SOM wafer to a cover wafer (46), thinning the handle layer of the SOM wafer (48), selective...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PILCHOWSKI, JORG, KLEIN, JONATHAN L
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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Beschreibung
Zusammenfassung:Micro-electromechanical systems (MEMS) pre-fabrication products and methods for forming MEMS devices using silicon-on-metal (SOM) wafers. An embodiment of a method may include the steps of bonding a patterned SOM wafer to a cover wafer (46), thinning the handle layer of the SOM wafer (48), selectively removing the exposed metal layer (50), and either continuing with final metallization (64) or cover bonding to the back of the active layer (62).