POLYAMIDE-POLYPHENYLENE ETHER RESIN COMPOSITION

The present invention can provide a resin composition characterized by comprising (A) a polyamide, (B) a polyphenylene ether, (C) an elastomer, and (D) a phosphorus compound selected from among phosphoric acids, phosphorous acids, hypophosphorous acids, metal phosphates, metal phosphites, metal hypo...

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Bibliographische Detailangaben
Hauptverfasser: NODA, KAZUYA, TERADA, KAZUNORI
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:The present invention can provide a resin composition characterized by comprising (A) a polyamide, (B) a polyphenylene ether, (C) an elastomer, and (D) a phosphorus compound selected from among phosphoric acids, phosphorous acids, hypophosphorous acids, metal phosphates, metal phosphites, metal hypophosphites, and phosphoric esters, wherein the resin composition contains 1 to 35 ppm of phosphorus element based on 100% by mass of the sum of the components (A) to (D), and can provide a molding composed of the resin composition. The resin composition can be used in a wide range of fields such as electrical/electronic parts, OA parts, vehicle parts and mechanical parts. In particular, the resin composition can be suitably used for exterior parts of automobiles or the like where large moldings are required.