Soft propylene-based resin composition
The invention relates to a soft propylene-based resin composition satisfying the following requirements (a) to (d): Requirement (a): the tensile modulus thereof, measured according to JIS K 7113, is from 10 MPa to 300 MPa; Requirement (b): the internal parallel light transmittance through it, measur...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | The invention relates to a soft propylene-based resin composition satisfying the following requirements (a) to (d):
Requirement (a): the tensile modulus thereof, measured according to JIS K 7113, is from 10 MPa to 300 MPa;
Requirement (b): the internal parallel light transmittance through it, measured according to JIS K 7105, is from 70 % to 100 %;
Requirement (c): the peak top temperature in the melting point profile thereof, measured through DSC, exists in the range of from 100°C to 165°C;
Requirement (d): it substantially comprises soft propylene-based resin particles having bulk density, measured according to JIS K 7365, of at least 0,3 g/cm 3 . |
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