Method of aligning mask layers to buried features

Method of aligning mask layers to buried features

A method for fabricating microchip devices is provided. The method includes the steps of providing a first planar substrate (120), locating at least one first alignment feature (128) in the surface (122) of the first planar substrate (120), and bonding a second substrate (140) to the surface (122) o...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHASE, TROY A, STALLER, STEVEN E, FREEMAN, JOHN E
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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Beschreibung
Zusammenfassung:A method for fabricating microchip devices is provided. The method includes the steps of providing a first planar substrate (120), locating at least one first alignment feature (128) in the surface (122) of the first planar substrate (120), and bonding a second substrate (140) to the surface (122) of the first planar substrate (120). The method further includes the step of aligning subsequent process operations performed on at least one of the first (120) and second (140) substrates to visible alignment features of the first substrate (120), wherein the visible alignment features are at least one of the first alignment feature (128) and a visible feature that corresponds to the location of the first alignment feature (128).