METHOD AND ARRANGEMENT FOR CONTACT-CONNECTING SEMICONDUCTOR CHIPS ON A METALLIC SUBSTRATE

METHOD AND ARRANGEMENT FOR CONTACT-CONNECTING SEMICONDUCTOR CHIPS ON A METALLIC SUBSTRATE

The method comprises the following steps: the substrate in the form of a one-piece basic substrate (4) is prepatterned into regions corresponding to future modules, pads of the semiconductor chip (1) are then contact-connected in predetermined regions of a first area of the basic substrate (4) and o...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MICHALK, MANFRED, NIELAND, SABINE, MICHALK, MARTIN
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The method comprises the following steps: the substrate in the form of a one-piece basic substrate (4) is prepatterned into regions corresponding to future modules, pads of the semiconductor chip (1) are then contact-connected in predetermined regions of a first area of the basic substrate (4) and on the top side (12) of the prepatterned basic substrate (4) and on one area side of the semiconductor chip (1) a first adhesive layer (16) is applied, a second adhesive layer (17) is subsequently applied to the other area side of the semiconductor chip (1), and a curing of the adhesive layers (16, 17) and a final patterning of the metallic basic substrate (4) are then effected.