AMIDE-SUBSTITUTED SILICONES AND METHODS FOR THEIR PREPARATION AND USE

A composition includes: (A) an amide-substituted silicone and (B) a thermally conductive filler. The composition may be used as a thermal interface material for dissipating heat from electronic devices.

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Bibliographische Detailangaben
Hauptverfasser:	ZHONG, BIANXIAO, LIN, ZUCHEN
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	A composition includes: (A) an amide-substituted silicone and (B) a thermally conductive filler. The composition may be used as a thermal interface material for dissipating heat from electronic devices.